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Electronic Materials Pte Ltd . . your preferred partner-supplier of electronic materials solutions. |
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Polymer Solutions for Circuit Assembly Encapsulation & Potting Hybrid/Thick Film Optoelectronic Semiconductor Packaging Thermal Management Automotive Electronics |
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EMI Shielding Gaskets EMI Shielding Tapes I/O Backplane Gaskets EMI Shielding Laminates
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Cyanoacrylate and Anaerobic Engineering Adhesives |
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Surface Protection, Masking and Specialty Tapes |
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Conductive Ink for RFID, Flex Circuits, Membrane Switches, High Density Interconnect |
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Engineered Films & Papers for Photovoltaic, RFID, Flex Circuit, Insulation, Biomedical |
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High Tech Metallurgy - Chemically Active Materials |
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Electrically Conductive, Thermal, Structural Adhesive Films & Preforms |
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Active Solder Alloy, Join Metal, Ceramic, Glass, Carbon Material Without Plating and Flux |
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Products |
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LORD is a diversified technology company with a long history of developing breakthrough electronic material, adhesive, coating and motion management technologies that significantly improve the performance of our customers’ products.
We have provided innovative solutions to demanding electronic, aerospace, defense, automotive and industrial customer problems for over 80 years.
With technology centers and manufacturing location around the world, our 2,500+ employees are ready to serve you with our polymer solutions for Circuit Assembly, Encapsulation, Optoelectronic, Semiconductor Packaging and Thermal Management.
Our solutions include Thick Film Materials for Hybrid Microelectronic and Electronic Components. |
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JEMIC Shielding Technology manufactures and distributes electromagnetic interference (EMI) shielding products.
Our products control undesired electromagnetic energy and radio frequency interference (RFI) from disrupting, or radiating from, electronic devices.
Our product lines consist of fabric-over-foam profile gaskets, shielding tapes, fabric-over-foam I/O gaskets, cable shielding, shielding laminates, and selectively coated, custom formable shields.
Our services include design consultation, prototyping and testing. All of our products are available in custom shapes, sizes and configurations. Our manufacturing lines and processes were developed to offer flexible product designs in both low and high volume runs.
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Parelec Inc. develops and markets a total RFID solution for different vertical markets. Founded in 1996 by Partnerships Limited, Inc., the developer of a patented technology for the fully additive printing of electrical circuits.
In March 2006 Parelec acquired the Israeli based Precision Systems, developer of active RFID and RTLS solutions for the automotive and defense markets.
Parelec operates today two business units delivering conductive inks and related materials for the printed electronic and RFID markets as well as active RFID and real time location solutions for the automotive and defense assets management markets.
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Permabond's history of developing and manufacturing engineering adhesives spans four decades and three continents.
Today, Permabond Engineering Adhesives Ltd (Europe & Asia) and Permabond (Americas) provide technological solutions to engineers all over the world, with office and facilities in America, Asia and Europe, backed by a high-tech ISO 9001:2000 certified production plant in Europe. |
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3M stands for its legal name, Minnesota Mining and Manufacturing Company. 3M is an innovative, highly diversified, multinational corporation with operations in more than 60 countries, and is a key player in Asia Pacific and the global economy with worldwide sales of over US$15 billion in 1998.
3M's vision is to be the most innovative enterprise and preferred supplier in every market served. 3M is a leading supplier of innovative solutions to the electrical, electronics, and telecommunications industries. Especially its surface protection, masking and specialty tapes. |
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Coveme specialized in the production of high performance films and papers, having developed exclusive process technologies of surface treatments, multilayer coating, lamination and heat stabilization, in materials temperature ranging up to 220°C with specific chemical and physical properties.
Coveme films and papers are used by manufacturers of electronic flexible circuitry, laser and ink-jet printable cards & tags, small and wide format digital printable films and transfer papers, manufacturers of sensors for medical applications and for the automotive industry, solar photovoltaic cells and RFID inlets manufacturers and silk-screening companies specialized in heat transfer for fabrics, plastics and metals.
The business is completed by the production of flexible insulating materials for the electrical motors and transformers industry and the distribution of polyester and nylon film for flexible food packaging. |
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Copyright © 2006 Electronic Materials Pte Ltd. 2, Kallang Pudding Rd., #06-10, Singapore 349307. |
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Alvatec Production and Sales GesmbH is a high-tech metallurgical company specializing in the processing of alkali and alkali earth metals. Alvatec tames pure alkali metals by alloying them and enable the usage of alkali metals for applications in e.g. vacuum technology, opto-electronics devices and sensors for medical investigation. It also support the development of new clean energy systems based on hydrogen. Alvatec supplies innovative high-capacity getters for vacuum insulation, vacuum tubes and mobile liquid gas tanks. Its Alvasources® which are chromate free and RoHS compliant alkali metal dispensers can be used for the production of photomultiplier tubes, image intensifier tubes, organic light emmision diodes (OLED) and for academic studies like Bose-Einstein-Condensation. Its product range is completed by new metallic hydrogen generators which produce high-yield hydrogen for fuel cells. |
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TechFilm 100% solid B-staged adhesive films and preforms replace liquid adhesives in electronic and industrial bonding and sealing. Films and preforms eliminate the messy handling issues associated with liquids, yet deliver exceptional performance.
TechFilm materials offer broad substrate compatibility including aluminum, ceramic, copper, engineered thermoplastics, FR4, glass, gold, Invar, Kapton®, Kovar, nickel, and other metals. When additional reinforcement, dimensional stability or enhanced performance properties are required, TechFilm can custom design films and preforms with support materials such as glass, nickel, carbon fibers, Kapton® or polyester films.
TechFilm Products: epoxy films, epoxy preforms, epoxy/urethane films, epoxy/urethane preforms, thermoplastic polyester films, thermoplastic polyester preforms, polyimide thermosetting films, polyimide thermosetting preforms.
Applications: thermal management, electrical conductivity, EMI/RFI shielding, structural bonding |
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S-Bond active solder alloy are used to join metals, ceramics, glasses, and carbon materials like diamond and graphite. Using its expertise in Active Solder Technology, S-Bond has developed a range of solutions that allows the cost effective assembly of unique combinations of materials without plating and fluxes.
Examples include copper to aluminum and graphite to aluminum for thermal management systems, sapphire to metal for lightweight sensor assemblies, and silicon carbide to titanium and other metals for lightweight armor and wear resistant surfaces. Its application also include direct die attachment for the electronics & semi-conductor industries. |