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Electronic Materials Pte Ltd . . your preferred partner-supplier of electronic materials solutions. |
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Polymer Solutions for Circuit Assembly Encapsulation & Potting Hybrid/Thick Film Optoelectronic Semiconductor Packaging Thermal Management Automotive Electronics |
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EMI Shielding Gaskets EMI Shielding Tapes I/O Backplane Gaskets EMI Shielding Laminates
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Cyanoacrylate and Anaerobic Engineering Adhesives |
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Surface Protection, Masking and Specialty Tapes |
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Conductive Ink for RFID, Flex Circuits, Membrane Switches, High Density Interconnect |
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Engineered Films & Papers for Photovoltaic, RFID, Flex Circuit, Insulation, Biomedical |
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High Tech Metallurgy - Chemically Active Materials |
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Electrically Conductive, Thermal, Structural Adhesive Films & Preforms |
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Active Solder Alloy, Join Metal, Ceramic, Glass, Carbon Material Without Plating and Flux |
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LORD is a diversified technology company with a long history of developing breakthrough electronic material, adhesive, coating and motion management technologies that significantly improve the performance of our customers’ products. We have provided innovative solutions to demanding electronic, aerospace, defense, automotive and industrial customer problems for over 80 years. With technology centers and manufacturing location around the world, our 2,500+ employees are ready to serve you.
LORD originated in Erie, Pa. over 80 years ago. Today, with annual sales exceeding $550 million, LORD is a worldwide leader in electronic materials, adhesives and coatings, vibration and motion control, and magnetically responsive technologies. Operating from world headquarters in Cary, N.C., LORD has 17 manufacturing facilities in nine countries and 90 strategically located sales and support centers worldwide.
As an agile, global technology company working across a broad spectrum of markets, LORD integrates human expertise and distinctive technology to increase the value of our customers’ products.
LORD provides advanced electronic solutions for the circuit assembly, hybrid/component thick film materials and semiconductor packaging, thermal management, automotive electronics and electronic potting and encapsulating markets.
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LORD Advance Electronic Materials include:
Semiconductor Packaging
Die Attach Adhesives MD-110 Electrically Conductive Die Attach Adhesive MD-120 Electrically Conductive, Semiconductor Grade Die Attach Adhesive MD-130 Electrically Insulating Die Attach Adhesive MD-140 Silver-Filled Die Attach Adhesive MD-200 Two Component, Electrically Conductive Die Attach Adhesive
Circuit Assembly
Surface Mount Adhesives CircuitSAF MA-420 Snap Cure, High Speed Dispensable and Printable
Chip-on-Board Encapsulants CircuitSAF ME-430 High Profile Glob Top Encapsulant CircuitSAF ME-455 High Purity, Fast Cure Cavity Fill Encapsulant CircuitSAF ME-455-1 Low CTE Epoxy MS-330 One Component, Heat Curing Silicone Encapsulant
Consumer Grade Glob-Top Encapsulants Circalok EP-729 One Component, Fast Curing Epoxy Circalok EP-937 One Component, Very Fast Curing Epoxy Circalok EP-939 One Component, Extra Fast Curing Epoxy
Silver-Filled Adhesives MD-110 Electrically Conductive Die Attach Adhesive MD-120 Electrically Conductive, Semiconductor Grade Die Attach Adhesive MD-130 Electrically Insulating Die Attach Adhesive MD-140 Silver-Filled Die Attach Adhesive MD-200 Two Component, Electrically Conductive Die Attach Adhesive
Underfill Encapsulants CircuitSAF ME-525 Flip Chip Underfill Encapsulant for High End Ceramic and Automotive Applications CircuitSAF ME-531 Flip Chip Underfill Encapsulant for Consumer and PCB Applications
Thermal Management
Gelease Gelease MG-100 High Thermal Conductivity/Low Thermal Resistance Gelease MG-120 Low Viscosity/Good Wetting Gelease MG-121 Thin Bondlines of 1-2 mils Gelease MG-122 Second Generation, Thermally Conductive Silicone Gel Interface Material Gelease MG-125 Excellent Moisture Resistance, Thermally Conductive Silicone Gel Gelease MG-200 Two Component, Thermally Conductive Silicone Gel
Thermally Conductive Greases TC-208 Water Cleanable, Thermally Conductive Grease Compound TC-228 High Temperature Resistant, Alcohol Cleanable TC-330 High Temperature Resistant, Thermally Conductive, Alcohol Cleanable TC-350 High Thermally Conductive Silicone Grease
Thermally Conductive Adhesives Circalok 6037 Thermally Conductive, Two Component Adhesive MT-125 Thermal Interface Material MT-220 High Thermally Conductive, Low Stress Adhesive MT-315 Thin Bondline, Low Thermal Resistance Adhesive
Encapsulation
Vacuum Potting & Impregnation Materials EP-809 Ignition Coil Impregnating and Encapsulation Epoxy EP-830 High Temperature, Low Viscosity, Vacuum Grade Epoxy
Potting & Encapsulation Circalok 6002 Epoxy Potting System, UL94V-0 Circalok 6009 Low Viscosity, Various Colors Epoxy Encapsulant, UL94V-0 Circalok 6031 Semi-Rigid, High Temperature, Excellent Arc Track Resistance Epoxy Encapsulant Circalok 6703 Thermally Conductive Silicone, UL94V-0 Circalok 6715 Condensed Cure, No Stress, No Inhibition Silicone Encapsulant LS213-9 One Component, Unfilled, Superior Moisture Resistance Epoxy Encapsulant SC-102 Unfilled, Repairable, Excellent Thermal Shock Resistance Silicone Encapsulant SC-300M Electronic Grade Silicone Gel Encapsulant SC-303 High Thermally Conducte Encapsulating System, UL94V-0 SC-309 Thermally Conductive Silicone Encapsulating System, UL94V-0 SC-2002HV One Component, Low Temperature Cure Silicone Conformal Coating UR-312 Microelectronic Grade, Clear, Low Modulus Urethane Encapsulating Gel UR-322 Two Component, Room Temperature Curing Urethane Potting Compound UR-325 Black, Hydrolytic and Elevated Temperature Stable Encapsulation System UR-329 Low Modulus, Urethane Potting/Encapsulating Compound UR-340 Flexible, Low Viscosity Urethane Encapsulant
Hybrid/Thick Film
Hybrid Microelectronic Materials LORD Corporation offers a complete state-of-the-art product line consisting of conductor, resistor and dielectric compositions for hybrid microelectronic applications. Each lot is 100% tested to insure product quality and reliability.
Silver Bearing Conductor Compositions Gold Bearing Conductor Compositions Cermet Dielectric/Overglaze Compositions Cermet Resistor Materials Cermet Potentiometer Materials
Polymeric Component Termination Materials LORD Corporation’s line of polymeric thick film inks are formulated for a wide variety of uses and are compatible with polyester, polycarbonate, polyimide, epoxy laminate, ceramic and porcelainized steel substrates.
Polymer Conductors Epoxies Polymeric Resistor Materials
Cermet Component Termination Materials LORD Corporation offers a wide selection of cermet materials for conductive terminations for most capacitors, resistors, thermistors, piezoelectric devices and other applications requiring solderable terminations. Many of the following compositions, although initially developed for a specific application, have multiple uses.
Silver Pastes for the Formation of Solderable Electrodes for Ceramic Piezoelectric Transducers Silver Pastes for the Formation of Solderable Electrodes for NTC/PTC Thermistor Applications Silver Pastes for General Applications
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Copyright © 2006 Electronic Materials Pte Ltd. 2, Kallang Pudding Rd., #06-10, Singapore 349307. |