Electronic Materials Private Limited

Electronic Materials Pte Ltd

. . your preferred partner-supplier of electronic materials solutions.

Polymer Solutions for

Circuit Assembly

Encapsulation & Potting

Hybrid/Thick Film

Optoelectronic

Semiconductor Packaging Thermal Management Automotive Electronics

EMI Shielding Gaskets

EMI Shielding Tapes

I/O Backplane Gaskets

EMI Shielding Laminates

Cyanoacrylate and Anaerobic Engineering Adhesives

Surface Protection, Masking and Specialty Tapes

Conductive Ink for RFID, Flex Circuits, Membrane Switches, High Density Interconnect

Engineered Films & Papers for Photovoltaic, RFID, Flex Circuit, Insulation, Biomedical

High Tech Metallurgy - Chemically Active Materials

Electrically Conductive, Thermal, Structural Adhesive Films & Preforms

Active Solder Alloy, Join Metal, Ceramic, Glass, Carbon Material Without Plating and Flux

Adhesive Films and Preforms

Electrically Conductive

Structural Materials

Thermally Conductive

F2591	F2591 is an electrically isolating material that features, a V-0 flammability rating, good chemical, heat, and moisture resistance.
T2381	Highly thermallly conductive B-staged film adhesive specially formulated for high temperature applications. Chemical resistance. Good adhesion to Aluminum.
T2581	A highly thermally conductive and electrically insulative single component screen printable adhesive. Provides excellent adhesion to a broad range of substrates, good chemical, heat, and moisture resistance along with low CTE, and a high Tg.
T2723	TechFilm T2723F is a thermally conductive and electrically insulative, B-staged film adhesive. It features a relatively low coefficient of thermal expansion moderately high glass transition temperature and good adhesion to various substrates. TechFilm T2723F will cure at temperatures above 90°C.
T2726	T2726 is a thermally conductive and electrically insulative, B-staged film adhesive cast from 100% solids. It also features good chemical, heat, and moisture resistance and low outgassing.
TF E2213F	A low outgassing adhesive especially suited for EMI/RF grounding applications. Excellent adhesion to gold or gold plated substrates and features good chemical, heat, and moisture resistance.
TF E2214F	Specifically formulated for bonding to gold or gold plated substrates. E2214 is especially suited for replacing solder on non-solderable substrates and EMI/RFI applications. It features low outgassing, good chemical, heat, and moisture resistance
TF E2551	An electrically conductive B-staged film adhesive specially formulated for Aluminum, stainless steel and Copper grounding applications where galvanic corrosion is a concern.
TF E3013	Single component silver filled liquid adhesive specifically formulated for bonding to gold or gold plated, nickel, and copper substrates. TechFilm E3013 will cure at temperatures above 120°C.
TF E3015	Single component pre-mixed and frozen silver filled adhesive. E3015 is a snap cure syringe or screen printable liquid adhesive featuring good chemical, heat, and moisture resistance with good adhesion to gold and nickel substrates.
TF T2121	High performance urethane modified epoxy featuring high bond strength. Cures at temperatures above 90°C. Standard formulation contains a 1.5 or 3.0 mil non-woven glass reinforcement for ease of handling. Available without a reinforcing layer.
TF T2122	Fast curing, low temperature cure. Urethane modified epoxy, specially formulated for bonding to plastic substrates. Urethanes by their nature are better to stick to plastics than an epoxy based material.
TF T2222F	Excellent adhesion to gold, nickel, invar and other hard to bond substrates. High thermal conductivity and electrically insulative film.
TF T2232	TechFilm T2232F is a high performance, high strength, highly thermally conductive\electrically insulating, B-staged film adhesive. It features a relatively low coefficient of thermal expansion, good adhesion to gold and high strength.
TF T2321	Formulated specifically for high temperature applications T2321P is a low outgassing single component screen printable thermally conductive and electrically insulative adhesive. T2321 provides excellent chemical and moisture resistance while providing good adhesion to both metal and plastic substrates.
TF T2422	TechFilm T2422F is a high performance, electrically insulative, B-staged film adhesive. It features a a rubber modified polymer backbone with moderately high glass transition temperature and good chemical resistance and adhesion to various substrates.
TF T2521	T2521 provides excellent adhesion to a broad range of substrates, good chemical, heat, and moisture resistance along with relatively low CTE, and a fairly high Tg.
TF T2526	Low out-gassing, electrically insulative film that has a relatively low CTE, high Tg, and good adhesion to various substrates. Features good chemical, heat, and moisture resistance. Cure at temperatures above 130°C.
TF T2531	High thermal conductivity, relatively low CTE, fairly high Tg., good chemical, heat, and moisture resistance. Cures at temperatures above 130°C.
TF T2722F	Low temperature cure, highly chemical resistant material providing high bond strength curing at temperatures above 90°C.
TF T2731	High performance, electrically insulative, low curing temperature material with good adhesion to various metals, including gold.
TF T2736	Fast curing, low out-gassing and low temperature curing material. Electrically insulative film with a relatively low CTE, high Tg. good adhesion to various substrates and good chemical, heat, and moisture resistance.
TF T2781	Highest thermally conductive\electrically insulating, fast cure material. Features good chemical, heat, and moisture resistance.
TF T3222	A high performance thermally conductive syringe dispense adhesive specially formulated for bonding gold, gold plated substrates, aluminum and other to difficult to bond metalic surfaces. T3222 also provides excellent chemical, heat, and moisture resistance.
TF T3583	Highest thermally conductive syringe dispense adhesive. T3583 is specifically formulated for aluminum heat sinks to a variety of inorganic substrates in high thermal K applications. T3583P also provides excellent chemical, heat, and moisture resistance and a high dielectric constant.

E3213	Single component silver filled syringe or screen printable adhesive formulated specifically for high temperature performance. E3213 delivers excellent adhesion to Aluminum and Gold substrates with good chemical, heat, and moisture resistance.
TF E2213F	A low outgassing adhesive especially suited for EMI/RF grounding applications. Excellent adhesion to gold or gold plated substrates and features good chemical, heat, and moisture resistance.
TF E2214F	Specifically formulated for bonding to gold or gold plated substrates. E2214 is especially suited for replacing solder on non-solderable substrates and EMI/RFI applications. It features low outgassing, good chemical, heat, and moisture resistance
TF E2313F	Developed specifically for high temperature applications E2313 is a high performance, low outgassing electrically conductive paste adhesive. The adhesive features a relatively low coefficient of thermal expansion, a high glass transition temperature and good adhesion to various substrates.
TF E2514	TechFilm E2514F is a high performance, electrically conductive, B-staged film adhesive developed for general purpose grounding applications. It features a relatively low coefficient of thermal expansion, a high glass transition temperature and good adhesion to various substrates.
TF E2551	An electrically conductive B-staged film adhesive specially formulated for Aluminum, stainless steel and Copper grounding applications where galvanic corrosion is a concern.
TF E2713F	Fast curing, highly chemically resistant film. Features a low CTE and high electrical conductivity. Good for difficult to bond substrates.
TF E2771CF3	TechFilm E2771CF3 is a three thousands of an inch film supported with two thousands of an inch carbon non-woven mesh. It is a high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold, brass and copper substrates.
TF E3013	Single component silver filled liquid adhesive specifically formulated for bonding to gold or gold plated, nickel, and copper substrates. TechFilm E3013 will cure at temperatures above 120°C.
TF E3015	Single component pre-mixed and frozen silver filled adhesive. E3015 is a snap cure syringe or screen printable liquid adhesive featuring good chemical, heat, and moisture resistance with good adhesion to gold and nickel substrates.

F2591	F2591 is an electrically isolating material that features, a V-0 flammability rating, good chemical, heat, and moisture resistance.
I2207	A very high strength material that has good adhesion and high bond strengths to various substrates including gold, nickel and stainless steel. This product features relatively high flow with good wetting properties, and a fairly high glass transition temperature.
T2381	Highly thermallly conductive B-staged film adhesive specially formulated for high temperature applications. Chemical resistance. Good adhesion to Aluminum.
T2581	A highly thermally conductive and electrically insulative single component screen printable adhesive. Provides excellent adhesion to a broad range of substrates, good chemical, heat, and moisture resistance along with low CTE, and a high Tg.
T2723	TechFilm T2723F is a thermally conductive and electrically insulative, B-staged film adhesive. It features a relatively low coefficient of thermal expansion moderately high glass transition temperature and good adhesion to various substrates. TechFilm T2723F will cure at temperatures above 90°C.
T2726	T2726 is a thermally conductive and electrically insulative, B-staged film adhesive cast from 100% solids. It also features good chemical, heat, and moisture resistance and low outgassing.
TF I2202F	It features relatively high flow with good wetting properties, fairly high glass transition temperature and good adhesion to gold and high strength. It also features good chemical, heat, and moisture resistance.
TF I2300F	For high temperature applications. Features high flow, high Tg and good adhesion to various substrates. Good chemical/heat/moisture resistance.
TF I2500F	High bond strength film features fairly high Tg, good adhesion to various substrates, good chemical/heat/moisture resistance.Cures at temperatures above 130°C.
TF I2506F	Low out-gassing, high flow and adhesion to various substrates, good chemical/heat/moisture resistance. Cures at temperatures above 130°C.
TF I2701F	Best in thin bond line applications. Supplied at a thickness of less than 0.003 inches. Highly chemical resistant film for lower temperature bonding.
TF I2800	TechFilm I2800 is a thermoplastic film adhesive for lid sealing, and other electronic applications.
TF I3001	A single component syringe dispense liquid adhesive that has excellent working stability at ambient temperatures. It is specially formulated for bonding to typically difficult to bond metal substrates.
TF I3202	A single component syringe dispense liquid adhesive that has been specially formulated for bonding to gold or gold plated substrates. TechFilm I3202 will cure at temperatures above 130°C. It features good chemical, heat, and moisture resistance.
TF T2121	High performance urethane modified epoxy featuring high bond strength. Cures at temperatures above 90°C. Standard formulation contains a 1.5 or 3.0 mil non-woven glass reinforcement for ease of handling. Available without a reinforcing layer.
TF T2122	Fast curing, low temperature cure. Urethane modified epoxy, specially formulated for bonding to plastic substrates. Urethanes by their nature are better to stick to plastics than an epoxy based material.
TF T2222F	Excellent adhesion to gold, nickel, invar and other hard to bond substrates. High thermal conductivity and electrically insulative film.
TF T2232	TechFilm T2232F is a high performance, high strength, highly thermally conductive\electrically insulating, B-staged film adhesive. It features a relatively low coefficient of thermal expansion, good adhesion to gold and high strength.
TF T2321	Formulated specifically for high temperature applications T2321P is a low outgassing single component screen printable thermally conductive and electrically insulative adhesive. T2321 provides excellent chemical and moisture resistance while providing good adhesion to both metal and plastic substrates.
TF T2422	TechFilm T2422F is a high performance, electrically insulative, B-staged film adhesive. It features a a rubber modified polymer backbone with moderately high glass transition temperature and good chemical resistance and adhesion to various substrates.
TF T2521	T2521 provides excellent adhesion to a broad range of substrates, good chemical, heat, and moisture resistance along with relatively low CTE, and a fairly high Tg.
TF T2526	Low out-gassing, electrically insulative film that has a relatively low CTE, high Tg, and good adhesion to various substrates. Features good chemical, heat, and moisture resistance. Cure at temperatures above 130°C.
TF T2531	High thermal conductivity, relatively low CTE, fairly high Tg., good chemical, heat, and moisture resistance. Cures at temperatures above 130°C.
TF T2722F	Low temperature cure, highly chemical resistant material providing high bond strength curing at temperatures above 90°C.
TF T2731	High performance, electrically insulative, low curing temperature material with good adhesion to various metals, including gold.
TF T2736	Fast curing, low out-gassing and low temperature curing material. Electrically insulative film with a relatively low CTE, high Tg. good adhesion to various substrates and good chemical, heat, and moisture resistance.
TF T2781	Highest thermally conductive\electrically insulating, fast cure material. Features good chemical, heat, and moisture resistance.
TF T3222	A high performance thermally conductive syringe dispense adhesive specially formulated for bonding gold, gold plated substrates, aluminum and other to difficult to bond metalic surfaces. T3222 also provides excellent chemical, heat, and moisture resistance.
TF T3321	Single component syringe dispense adhesive specifically formulated for high temperature applications. T3321 is optimized for bonding gold, gold plated substrates aluminum and other to difficult to bond metalic surfaces. T3321 also provides excellent chemical, heat, and moisture resistance.
TF T3583	Highest thermally conductive syringe dispense adhesive. T3583 is specifically formulated for aluminum heat sinks to a variety of inorganic substrates in high thermal K applications. T3583P also provides excellent chemical, heat, and moisture resistance and a high dielectric constant.